Summary: Ipc Pcb Advanced Designer Certification | IPC Designer council

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  • 1 Design considerations

  • 1.1 Board Material Properties

    This is a preview. There are 2 more flashcards available for chapter 1.1
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  • Why are board material properties a critically important element of a printed circuit design?

    • Mechanical support of both the circuit conductors and the components which those conductors interconnect.
    • electric performance:
      the dielectric constant and loss tangent of the board material can significantly effect board design. 
    • from manufacturing perspective:
      dimensional stability => yield , cost
      difficulty to process
    • Thermal performance: both in assembly and in use
      hand soldering, rework, component replacement => higher temp

  • Give two broad categories of base material (substrates):

    • organic substrates:
      - layers of paper impregnated with phenolic resin
      - layers of woven or nonwoven glass cloth impregnated
         with epoxy resin, polyimide, cyanate ester, BT resin, etc.
    • inorganic substrates:
      ceramic and metallic materials such as aluminium, soft iron,
      and copper-invar-copper. 
  • Which are the construction elements of Board Materials?

    • Resin systems
    • Reinforcements
    • Metal foils 
  • Which are the most commonly used resin systems? #4

    • Epoxies: a good blend of physical, electrical and processing properties at reasonable cost
    • Polyimide: highest operating temperature => rework & repair friendly
    • Cyanate Ester:
      low dielectric constant =>high speed design
      good thermal performance
    • Bismaleimide Triazine(BT resin):
      high temperature at reasonable cost => BGA packages
  • What are the most commonly used reinforcements?What is their function?

    Reinforcements provide the dimensional stability and the bulk of the mechanical properties.
    • glass cloth: E type glass is most used.
    • Glass Felt: nonwoven glass mat, most used in combination with fluoroplastic resins
    • Aramid cloth: negative CTE in X, Y but high in Z 
    • Aramid paper
  • Which are the common thicknesses for copper foil?

    • half ounce (17 µm)
    • one ounce (35 µm)
    • two ounce (70 µm)
    Thinner foils are commonly used to facilitate the manufacture of fine line circuits.
    Thicker copper foils are used for power and ground distribution
  • Which material for flexible laminates is regularly used?

    • Polyimide films: high temperature, high speed
    • polyester films: low cost
  • Which are the key environmental material properties? #4

    • Thermal expansion:
      changes in the XY-plane, controlled by reinforcement 
      CTE [ppm/°C]
    • Glass transition temperature: Tg
      above Tg expansion in the Z-axis, at rate much faster than XY-axis
      determined by the resin system
    • Moisture Absorption:
      most organic materials are hygroscopic
    • Temperature at decomposition Td
  • From which two perspectives expansion is a concern to the designer?

    1. Potential warpage of the assembly
    2. damage to the plated through holes
    High glass transition materials tend to be more forgiving.
  • Discuss Thermal expansion in relation to XYZ-axis and Tg?

    Thermal expansion [ppm/°C] in Z-axis is several times greater than expansion in XY-plane.
    Above Tg, expansion in Z-axis can be as much as four times greater than below Tg.
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